$55.4
$66.48
High-Performance Three-Zone PECVD System for Precision Thin Film Deposition Product Overview The ZYLAB 1200°C Dual-Zone PECVD System is designed for advanced thin-film deposition processes requiring precise precursor evaporation, stable plasma conditions, and reliable exhaust management. Equipped with a solid–liquid evaporation module, 4-channel mass-flow-controlled gas delivery, and an anti-condensation exhaust treatment design, this system offers a highly efficient, safe, and environmentally friendly PECVD solution. In this configuration, a liquid vapor generator is installed at the front end to ensure accurate delivery of liquid precursors, while a vacuum pump exhaust treatment tank is integrated at the backend to minimize harmful emissions. Together, they create a stable and clean deposition environment, preventing condensate buildup and ensuring long-term operational reliability. This PECVD system is ideal for research institutes, laboratories, semiconductor processing, epitaxy, dielectric coatings, surface modification, and high-precision material deposition applications. Key Features of 1200°C Dual-Zone PECVD System 1. Precision Temperature Control System Advanced PID regulation: Ensures highly accurate control of evaporation and deposition temperatures for optimal precursor vaporization. Fast response: Supports rapid heating and cooling to accommodate diverse process requirements. 2. High-Efficiency Evaporation Optimized evaporator design: Maximizes evaporation efficiency while minimizing residue buildup, ensuring stable and consistent vapor delivery. 3. Reliable Anti-Condensation Measures The vacuum pump exhaust treatment tank effectively removes or reduces harmful gases such as VOCs, acidic compounds, and particulates. Prevents condensation inside pipelines and equipment, ensuring safe operation and compliance with environmental standards. 4. Intelligent Control & Monitoring Touch-screen interface: Intuitive operation for parameter setting, process control, and system monitoring. Data logging & analysis: Automatically records key operational data and generates exportable reports for process optimization. 5. 4-Channel Gas Delivery System Equipped with high-precision mass flow controllers (MFCs), allowing accurate and independent gas input control for complex PECVD processes. Technical Parameters Model PECVD1200-80-2 Rated Power 7.5 kW 1.5 kW Power Supply Three-phase 380 V, 50 Hz RF Frequency 13.56 MHz RF Power Range 0–500 W Deposition Heating Power 2.5 kW Evaporator Rated Power 1.3 kW Heating Tape Power 75 W Maximum Temperature (Tmax) 1200°C Deposition Temperature 1150°C Evaporator Temperature 400°C Heating Tape Temperature 150°C Temperature Accuracy ±1°C Sensor Type K-type Thermocouple Heating Rate 1°C/h – 20°C/min Chamber Size (Zone 1)Φ150 × 200 mm (Zone 2)Φ150 × 200 mm Quartz Tube Size Φ80 × 1400 mm Heating Element Mo-doped Fe-Cr-Al Alloy Gas Delivery (4 Channels) Mass Flow Controllers: S500 50 SCCM × 2 channels: Φ6.35 compression fittings, N₂-calibrated S500 30 SCCM × 1 channel: Φ6.35 compression fittings, N₂-calibrated S500 1000 SCCM × 1 channel: Φ6.35 compression fittings, N₂-calibrated Control System Programmable sintering/processing curves with dynamic graphical display Scheduled processing for unattended operation Real-time power/voltage display, full data recording and export Remote monitoring and control capability Temperature calibration: Non-linear correction based on master and sample temperature deviations Liquid Vapor Generator Peristaltic Pump Ensures precise delivery of liquid precursors Efficient conversion from liquid to vapor phase Guarantees uniform gas transport, enhancing film quality and process repeatability Vacuum Pump Exhaust Treatment Tank Removes VOCs, acidic gases, and particulates Prevents condensation and pipeline contamination Ensures emissions meet environmental safety standards Protects equipment and operator safety Furnace size 2230 × 800 × 1300 mm Net weight 260 kg Service Support 1-year limited warranty, with lifetime support (Warranty excludes consumable parts such as processing tubes and O-rings; please order replacement parts from the related products section below). Optional Upgrades（Exhaust Gas Purifier） ZYLAB Epitaxial Furnace Exhaust Gas Purifier Features two spray chambers one packed column Manual negative pressure control Adjustable water replenishment Achieves up to 99.99% removal efficiency for water-soluble gases Ideal for semiconductor epitaxy, PECVD, LPCVD, MOCVD, and other gas-heavy processes. Typical Application Semiconductor ProcessingDeposition of dielectric films, passivation layers, barrier coatings, and encapsulation layers for silicon wafers, compound semiconductors, and advanced microelectronics. Surface Engineering & Functional CoatingsFabrication of protective, optical, insulating, and barrier films used in optics, energy devices, and electronic components. Epitaxy and Material GrowthControlled deposition of high-purity thin layers for epitaxial structures and advanced material synthesis. Nanomaterials & Advanced Thin FilmsGrowth of nanostructured films, nanocomposites, and functional materials requiring precise plasma-enhanced reactions. MEMS & Sensor FabricationDeposition of structural, insulating, and functional layers for micro-electromechanical systems and high-sensitivity sensors. Photovoltaics & Energy TechnologiesThin-film deposition for solar cells, battery electrodes, protective layers, and energy storage materials. R&D Laboratories & UniversitiesExperimental development of new thin-film processes, precursor studies, material property research, and atmospheric/temperature-dependent deposition experiments. Click to see more content: How to Choose the Right PECVD Furnace? For More Options on PECVD Furnace System Click here [PECVD Furnace System Collection] For More Options on High Temperature Furnaces Click here [High Temperature Furnaces Collection] Get In TouchFill out the form below — free quote and professional suggestion will be sent for reference very soon! Name Email* Message Send
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